JPH0363219B2 - - Google Patents
Info
- Publication number
- JPH0363219B2 JPH0363219B2 JP56040111A JP4011181A JPH0363219B2 JP H0363219 B2 JPH0363219 B2 JP H0363219B2 JP 56040111 A JP56040111 A JP 56040111A JP 4011181 A JP4011181 A JP 4011181A JP H0363219 B2 JPH0363219 B2 JP H0363219B2
- Authority
- JP
- Japan
- Prior art keywords
- region
- dielectric
- semiconductor device
- oxide film
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/76—Making of isolation regions between components
- H01L21/762—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
- H01L21/7624—Dielectric regions, e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers using semiconductor on insulator [SOI] technology
- H01L21/76264—SOI together with lateral isolation, e.g. using local oxidation of silicon, or dielectric or polycristalline material refilled trench or air gap isolation regions, e.g. completely isolated semiconductor islands
- H01L21/76281—Lateral isolation by selective oxidation of silicon
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Bipolar Transistors (AREA)
- Element Separation (AREA)
- Recrystallisation Techniques (AREA)
- Local Oxidation Of Silicon (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56040111A JPS57154856A (en) | 1981-03-19 | 1981-03-19 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP56040111A JPS57154856A (en) | 1981-03-19 | 1981-03-19 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57154856A JPS57154856A (en) | 1982-09-24 |
JPH0363219B2 true JPH0363219B2 (en]) | 1991-09-30 |
Family
ID=12571736
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP56040111A Granted JPS57154856A (en) | 1981-03-19 | 1981-03-19 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57154856A (en]) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1984004996A1 (en) * | 1983-06-13 | 1984-12-20 | Ncr Co | Process for fabricating semiconductor structures |
JPS6072243A (ja) * | 1983-09-28 | 1985-04-24 | Matsushita Electric Ind Co Ltd | 半導体集積回路装置 |
JPS6074452A (ja) * | 1983-09-29 | 1985-04-26 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法 |
JPS60127740A (ja) * | 1983-12-15 | 1985-07-08 | Matsushita Electric Ind Co Ltd | 半導体集積回路装置 |
JPS62274740A (ja) * | 1986-05-23 | 1987-11-28 | Nec Corp | 半導体装置 |
US6110798A (en) | 1996-01-05 | 2000-08-29 | Micron Technology, Inc. | Method of fabricating an isolation structure on a semiconductor substrate |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6028387B2 (ja) * | 1979-07-12 | 1985-07-04 | 松下電器産業株式会社 | 半導体装置の製造方法 |
-
1981
- 1981-03-19 JP JP56040111A patent/JPS57154856A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS57154856A (en) | 1982-09-24 |
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